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Hongtao Xu
Professor at Fudan University
Hongtao Xu is a prominent figure in the field of electrical engineering and solid-state circuits. He currently serves as an Associate Editor for the IEEE Journal of Solid-State Circuits (JSSC), a position he has held since 2023.1
Professional Background
Hongtao Xu is a Professor at Fudan University in Shanghai, China, a role he has occupied since 2015.1 Prior to his academic career, he spent 10 years (2005-2015) as a Research Scientist at Intel, where he focused on RF circuits/systems research, design, and testing.1
Education
Xu's educational background includes:
- PhD in Electrical and Computer Engineering from UC Santa Barbara
- BS and MS in Electrical Engineering from Fudan University (1993-1999)1
Research and Expertise
His areas of specialization include:
- RF/Microwave/mmWave IC Design
- High Speed Analog IC Design
- Radio Transceiver Architecture
- System Architecture for Wireless SoC
- Post Silicon Debug and Validation1
Professional Activities
Hongtao Xu is actively involved in several prestigious IEEE committees and conferences:
- IEEE ISSCC ITPC - RF subcommittee member (2020-present)
- IEEE MWTL Associate Editor (2019-present)
- IEEE RFIC SC/TPC member (2014-present)
- IEEE IEDM TPC member (2021-2022)1
Entrepreneurship
In addition to his academic and editorial roles, Xu is also an entrepreneur. He co-founded and serves as the Chairman of ICLEGEND MICRO, a position he has held since 2018.1
Hongtao Xu's LinkedIn username is indeed "redheart", as mentioned in the query.1
Highlights
Join us at the 2024 IEEE RFIC Symposium in Washington, DC! Register NOW: https://lnkd.in/e54fxzym The IEEE RFIC Symposium is the premier annual forum focused on presenting the latest breakthroughs and research results in all areas related to radio frequency (RF), millimeter-wave (mmWave), and wireless Integrated Circuits (ICs). The RFIC Symposium, combined with the International Microwave Symposium (IMS), ARFTG, and the Industry Exhibition, forms the “IMS Week”, the world’s largest RF and microwave technical meeting of the year.
Welcome to the world's premier RFIC conference in June!
We invite you to join us in the 2021 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, to be held as a first-ever hybrid event with both in-person and virtual components. The in-person RFIC Symposium has been merged with the in-person International Microwave Symposium (IMS) and will take place in Atlanta, GA on 7-9 June 2021. You will enjoy a plenary session, that will feature the CTOs from Texas Instruments and Honeywell, a complimentary technical lecture program covering key MW/RF topics, 13 technical sessions featuring both RFIC and IMS papers, and the IMS exhibition. The virtual RFIC Symposium will start two weeks after, on 20-25 June 2021. Attendees will use an on-line platform to access content and interact with others. All content will be live-streamed by presenters throughout the week and then available on demand for one month. The virtual symposium includes a plenary session with speakers from U. Twente and Intel, 14 technical sessions of RFIC papers, 12 workshops, four complimentary technical lectures, two panels, a demonstration forum, and a virtual exhibition. All attendees to our in-person symposium will receive complimentary access to the virtual symposium.
