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Jason Huang

Electro Ceramic & Device Group Director

Professional Background

Jason Huang is a seasoned professional in the field of ceramics and electronic packaging, with a primary focus on ceramics PCB substrates, hermetic sealing packages, power modules utilizing Silicon Carbide (SiC) and Gallium Nitride (GaN), as well as flip-chip interconnect technologies. With years of dedicated experience in multi-layer ceramic substrates and packaging, he has built a strong portfolio encompassing various materials such as LTCC (Low-Temperature Co-fired Ceramic), HTCC (High-Temperature Co-fired Ceramic), Al2O3, AlN, SiN, and BN. His deep knowledge and expertise in the sintering processes, both shrinkage and non-shrinkage variations, enable him to contribute significantly to the advancements within the electronics industry.

In the realm of manufacturing technologies, Jason is well-versed in Electro Casting Copper (E.C.C. Metallization), sputter metallization, and thick film metallization processes. His understanding of advanced surface treatments, specifically electroless nickel, palladium, and gold plating, positions him as a key contributor to enhancing the reliability and quality of electronic components. His abilities extend to prototype capabilities, including vacuum soldering, GGI, double-side sintering, die/wire bonding, SMT (Surface Mount Technology), as well as encapsulation and dicing of ceramic components.

Education and Achievements

Jason Huang began his academic journey at The Harker School, where he laid the foundation for a robust educational background in technology. He then advanced his studies at San Jose State University, earning both a Bachelor of Science degree in Industrial Technology and a Bachelor's degree focusing on Industrial Technology/Technician. Furthermore, Jason diversified his skill set by pursuing an Associate's degree in Web Publishing from Foothill College, showcasing his adaptability and eagerness to assimilate cutting-edge technological tools in his professional practice.

His transition into the corporate world commenced with an internship at Taiwan Microelectronics Technologies Inc, where he was exposed to real-world applications of his academic learning. This experience helped shape his career in the microelectronics and ceramics industry, leading him to pivotal roles at established companies.

Career Progression and Notable Roles

Throughout his career, Jason has taken on several critical roles within leading companies in the field of electronics and microelectronics. He served as the Electro Ceramic & Device Group Director at Sentec E&E Co., Ltd, where he directed innovation and development strategies, significantly impacting the company's growth and product advancements. His earlier tenure as the LTCC Group/Biz Development Director at Sentec E&E Co., Ltd saw him drive initiatives that enhanced business opportunities and operational efficiencies.

Before his notable positions at Sentec, Jason honed his engineering skills as an IC Packaging Engineer at Panasonic Shikoku Electronics Co., Ltd. Here, he was involved in the design and implementation of integrated circuit packaging solutions, utilizing his technical skills and substantial understanding of the industry to deliver superior products. Additionally, serving as the LTCC Group/Production Manager at Shanghai SENTEC Co., Ltd allowed him to gain invaluable insights into production management and team leadership in an international context.

Achievements

Jason Huang’s career is marked by a series of noteworthy achievements. His extensive experience and hands-on involvement with multi-layer ceramic substrates have positioned him as a thought leader in the industry. By successfully integrating advanced materials and innovative processes into product designs, he has contributed to the advancement of electronics packaging technologies. He is particularly recognized for his ability to execute complex manufacturing techniques and for his contributions to developing high-performance packaging solutions that cater to modern-day electronic applications.

His leadership qualities and strategic vision have made him an influential figure in the organizations he has been part of, guiding teams towards achieving excellence in production and product development. Jason's proficiency and contributions to the field of ceramics and electronics continue to inspire his colleagues and peers, making him a valued asset to the industry and a respected member of the technology community.

Related Questions

How did Jason Huang develop his expertise in ceramics PCB substrate technology?
What are the key innovations Jason Huang has introduced in hermetic sealing packages?
How has Jason Huang's education at San Jose State University influenced his career in industrial technology?
What challenges has Jason Huang faced in his roles at Sentec E&E Co., Ltd and how did he overcome them?
In what ways has Jason Huang contributed to advancements in power module technologies such as SiC and GaN?
What impact has Jason Huang's work had on the field of flip-chip interconnect technology?
How does Jason Huang leverage his background in web publishing in his current role within the electronics industry?
What are some of the significant projects Jason Huang has lead that showcase his leadership in electro ceramics?
Jason Huang
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Location

Taiwan