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Mahmoud Elzouka

Intel Packaging Thermal R&D Engineer

Dr. Mahmoud Elzouka is a seasoned mechanical engineer with a Ph.D., specializing in optimum design using numerical simulations, machine learning, stochastic optimization, and cluster computing.

His expertise includes the development of custom tools such as microfabrication of MEMS, heater design, thermal expansion mechanism, laser ablation platform for rapid microstructure fabrication, high-temperature chamber for reflectance and thermal emittance measurements, and automated heat transfer measurement at the microscale.

His focus areas encompass photonics, thermal radiation, cryogenic refrigeration, and chemical process engineering.

Dr. Elzouka completed his Doctor of Philosophy (Ph.D.) in Mechanical Engineering at the University of Nebraska-Lincoln, a Master of Science (MS) in Cryogenic Air Separation - Heat-Integrated Distillation at Alexandria University, and a BSc. in Mechanical Engineering - Engineering with Excellence (equivalent to A+) at Alexandria University.

He has held various roles at renowned organizations, including Packaging Thermal Engineer at Intel Corporation, Affiliate Scientist at Berkeley Lab, Postdoctoral Researcher at Berkeley Lab and University of Nebraska-Lincoln, Lecturer at University of Nebraska-Lincoln, Graduate Researcher at Cornell University, Graduate Research Assistant at University of Nebraska-Lincoln, and Demonstrator at Faculty of Engineering (Alexandria University, Egypt), Arab Academy for Science and Technology and Maritime Transport, Pharos University in Alexandria. Mahmoud Elzouka also completed an Engineering Internship at Kharafi National.

Mahmoud Elzouka
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Location

San Francisco Bay Area