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Michael Campbell

Sr. VP Engineering at Qualcomm

Michael Campbell is the Senior Vice President of Engineering at Qualcomm.1 He has a demonstrated history of working in the wireless industry and is skilled in embedded software, Joint Test Action Group (JTAG), EDA, microprocessors, and Application-Specific Integrated Circuits (ASIC).1

Campbell graduated from Clarkson University with a degree in BSEE/CE.1 Before becoming Senior VP of Engineering in October 2008, he was the VP of Engineering from 2001 to 2008, and before that was in Engineering from 1997 to 2001.1 Prior to joining Qualcomm, Campbell was an Engineering Manager at Inmos from 1980 to 1983.1

Campbell is responsible for QCT (Qualcomm CDMA Technologies) Product and Test, Test Automation, Failure Analysis, and yield.23 He has led multiple teams and has helped bring up and drive the design office in Bangalore, the Design and Test development center in Singapore, and a development facility in Taiwan.2 Campbell is currently focused on improving processes impacting TTM (Time-to-Market), new process node enablement, and driving machine learning for PTE (Product Test Engineering) and Yield engineering.2

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Michael Campbell
Michael Campbell, photo 1
Michael Campbell, photo 2
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Location

Encinitas, California, United States