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Vladmir Perelman

VP 3D CSP Business Unit at Amkor

Vladmir Perelman is a highly accomplished professional in the field of Mechanical Engineering.

He holds a degree in Mechanical Engineering from Tallinna Tehnikaülikool.

Vladmir has held significant roles in various prestigious organizations, showcasing his expertise and leadership in the industry.

He has served as the Former Senior Vice President of Flip Chip, Bump, and WLCSP, Product Business Unit at Amkor, contributing to the company's success and growth.

Prior to that, he held the position of Director of Engineering at Acqutek, where he demonstrated his strong engineering capabilities.

His experience also includes being the Director of Engineering at Dyna-Craft (National Semiconductor), a role where he excelled in managing engineering operations.

Vladmir Perelman has also served as a Plant Manager at Stamping Technology, further solidifying his managerial skills and technical expertise.

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Location

San Francisco Bay Area