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William Cheng

Lead Engineer at T. Rowe Price

William Cheng is a Lead Engineer at T. Rowe Price, based in Brooklyn, New York.2 He has a strong educational background, holding an MBA in Business Analytics from New York University's Leonard N. Stern School of Business, as well as a Master of Engineering in Computer Science and a Bachelor of Arts in Computer Science and Economics from Cornell University.

Prior to his current role at T. Rowe Price, William has held several prominent positions in the tech industry, including:

  1. Tech Lead at Amperity (2019-2020)1
  2. Tech Lead and Senior Engineer at Custora (2015-2019)1
  3. Analyst to the Vice President at Goldman Sachs

William joined T. Rowe Price as a Lead Engineer in June 2020.1 His experience spans various aspects of software engineering and data analytics, making him a valuable asset in the investment management industry.

With over 500 connections on LinkedIn2, William Cheng appears to be a well-connected professional in his field. His career trajectory demonstrates a consistent progression in technical leadership roles within the financial technology sector.

Highlights

May 17 · GeekWire
Noteworthy spinout: Flowdex comes out of Seattle's AI2 with app using AI to manage notes - GeekWire
May 17 · GeekWire
Noteworthy spinout: Flowdex comes out of Seattle's AI2 with app using AI to manage notes - GeekWire
Noteworthy spinout: Flowdex comes out of Seattle's AI2 with app using AI to manage notes - GeekWire
Jan 1 · aeroleads.com
William Cheng Email, Phone Number, Company, Colleagues ...

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William Cheng
William Cheng, photo 1
William Cheng, photo 2
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Location

Brooklyn, New York, United States