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Ioannis Savidis

Assistant Professor, Drexel University

Ioannis Savidis is an expert in the field of 3-D integration, specializing in electrical and thermal modeling, reliability analysis, and experimental verification.

With a Ph.D. in Electrical and Computer Engineering, Ioannis has a strong educational background from the University of Rochester and Duke University.

He has previously held key research positions at prestigious organizations like IBM, MIT Lincoln Laboratory 3DM2, and Freescale Semiconductor.

Ioannis Savidis has worked extensively on electrically characterizing and modeling IBM's through-silicon-vias, along with designing 3-D integrated test vehicles for experimental characterization of TSVs.

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Location

Philadelphia, Pennsylvania, United States