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Timo Henttonen

Director - IC Packaging / Silicon Development at Microsoft

Timo Henttonen is a highly skilled and experienced technical director with over 20 years of experience in the wireless industry, specializing in R&D of IC packaging and silicon development.5 He currently holds the position of Director of IC Packaging and Silicon Development at Microsoft.5

Henttonen's professional background includes:

  1. Strong leadership skills and extensive experience in the field.1
  2. Expertise in advanced chip packaging, which is emerging as a key technology in the semiconductor industry.3
  3. Involvement in calling for abstracts related to his field of expertise.4

His LinkedIn profile indicates that he is based in Mountain View, CA, and has worked for Microsoft and at least two other companies.2 Henttonen's educational background includes studies at Tampere University of Technology.1

In his current role at Microsoft, Timo Henttonen plays a pivotal role in advancing the company's technological capabilities in IC packaging and silicon development.5 His work likely contributes to Microsoft's efforts in pushing the boundaries of semiconductor technology as the industry approaches physical limits of chip miniaturization.3

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Timo Henttonen
Timo Henttonen, photo 1
Timo Henttonen, photo 2
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Location

Mountain View, California